Industry Leading Technology

Compact Polymer Casting Machine Base
A quartz-epoxy, castable material is used to replace cast iron or steel as a
machine platform. This material offers excellent vibration dampening and thermal
stability for precision machine tools.

Individual Precision Grinding Spindles
The First spindle in contact with the wafer has a course mesh diamond grinding
wheel for aggreessive removal of wafer material. The next one uses a finer mesh
wheel to meet surface quality specifications.

Individual Grinding Wheel Dressing Stations
The dressing stations keep both grinding wheels in optimal condition. They are fully
integrated into the TRAG process to ensure optimal timing of the dressing procedure
during grinding.

Non-Contact Wafer Thickness Measuring System
During the grinding process, the wafer thickness is measured continuously with
a high-resolution sensor system on both, coarse and fine grinding side. Highest
possible reqirements on final thickness and surface quality can be achieved.

Cassette-toCassette Wafer Handling
Wafers are positioned for processing with a reliable pick-and place system.

TRAG Process
Patent pending Adaptive Grinding Process.
Real-time measurements during the grinding process are fed into the controller for
adjustments to RPM's, in-feed speeds and dressing cycle timing. This automatic,
adaptive process control is the key to new levels of performance and functionality
by finding the best grinding parameters in real-time.