©2006 UltraGrind™

Welcome to UltraGrind

What differentiates products today is innovative technology that results in higher productivity.

UltraGrind is introducing a next-generation engineering solution with advanced processing
software that benefits manufacturers of compound semiconductor wafers.

The patented UltraGrind G252 Precision Grinding Center monitors and controls the grinding process
in real-time until the final wafer thickness and surface specifications are reached. In many
applications additional wafer polishing operations can be eliminated. (See our features).

With UltraGrind, grinding wheel speeds, contact pressure, wheel dressing systems, non-contact
wafer thickness measuring systems and cassette-to-cassette handling system functions are all
controlled by TRAG application software.

In the competitive world of semiconductor manufacturing, continued success demands increased
productivity at lower costs. UltraGrind provides you the tools to meet those goals.

Key Benefits :

· Optimum production rates
· Uniform wafer thickness
· Minimal operator assistance
· Wafers ground to final thickness - lapping or polishing of wafers can be eliminated in most cases